Our state-of-the-art printed circuit board assembly equipment and processes lead the EMS industry in technical capability, quality and efficiency.
Our certified IPC 610 trainer works together with operators to ensure the highest quality in printed circuit board product standards.
Our one-stop solution can fit all your printed circuit board assembly capability needs:
- Volume: No minimum order quantity, Engineering prototypes, Low cost first article builds
- Parts Procurement: Turnkey, Kitted/Consigned, Partial Turnkey
- Assembly Types: Surface Mount (SMT), Thru-hole, Mixed Technology (SMT/Thru-hole), Single or double side placement, Fine Pitch Components
- Flex Circuit Assembly
- Solder Types: Lead-free/RoHS compliant, No-clean process available
- Inspection: 2D SPI, FI AOI, SMT AOI, X-RAY
- Test Capabilities: Functional test, humidity test, high and low temp, salt fog, vibration, shock
Some parameters:
- Stencil size range: 1560*450mm
- Min. SMT Package: 01005
- Min. IC Pitch: 0.3mm
- Max. PCB Size: 1200*400mm
- Min. PCB Thickness: 0.35mm
- Min. Chip size: 01 005
- Max. BGA size: 74*74mm
- BGA ball pitch: 0.4 to 1.0mm
- BGA ball diameter: 0.45 to 0.76mm
- QFP lead pitch: 0.38 to 2.54mm
